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双面多层电路板
作者:  admin     发布日期:2017-10-25

高登威德电子可以生产的PCB为1-16层,铜厚为1-12oz, 请参考以下我们的PCB规格参数:

Item
Specification
Remarks
Number of Layer
1-14 layers
 
Material
CEM-3,FR-4
High Tg CCL Is Available
Finish Board Thickness
0.2mm-3.20mm
 
( 8mil-126mil)
Minimun Core Thickness
0.075mm(3mil)
 
Copper Thickness
1/2 oz min; 3 oz max
 
Min.Trace Width & Line Spacing
0.075mm/0.1mm(3mil/4mil)
 
Min.Hole Diameter for CNC Driling
0.25mm(12mil)
 
Min.Hole Diameter for Punching
0.9mm(35mil)
 
Biggest Pabek Sise
700mm×510mm
 
 
Dunebsuib
Tikerabce
Hole Positon
+/-0.075mm(3mil) CNC Driling
 
Conductor Width(W)
+/-0.05mm(2mil)or
 
+/-20% of original artwork
Hole Diameter(H)
PTH L:+/-0.075mm(3mil)
 
Non-PTH L:+/-0.05mm(2mil)
Outline Tolerance
+/-0.125mm(5mil) CNC Routing
 
+/-0.15mm(6mil) by Punching
Warp & Twist
0.7%
 
Insulation Resistance
<50ohm
 
Test Voltage
300V
 
V-Cutting
Panel Size
110×100mm(min)
Jump Score Is Available
660×600mm(max)
Multilayers
Layer-layer misregistration
4 layers:0.15mm(6mil)max
 
6 layers:0.25mm(10mil)max
Min.spacing between hole edge to circuity pqttern of an inner layer
0.25mm(10mil)
 
Min.spacing between board oulineto circuitry pattern of an inner layer
0.25mm(10mil)
 
Board thickness tolerance
4 layers:+/-0.13mm(5mil)
 
6 layers:+/-0.15mm(6mil)
Impedance Control
20-75 ohm+/-10%
 
Different Impendance
75-150 ohm+/-10%
 
Finish Board Surface
HASL,OSP,Au /agimmersion,Au Plating Etc

 

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