Shenzhen Golden Weald Electronic Co., Limited

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      Shenzhen Golden Weald Electronics Co., Ltd. is a manufacturer specializing in the research & development, manufacture and marketing of PCB boards. We have had about 500 workers and 10 R&D technicians since our company was established in Shenzhen City of Guangdong Province in 2004.

      Our company has passed ISO9001:2008 quality control system. Our products have passed UL certification and RoHS and REACH test reports. We also provide OEM/ODM services and PCB Assembly. We design and process all kinds of electronic decorations according to customers' requirements. 

      "Quality first, customer highest and service thoughtful" is the management principle that we always adhere to. Our working target is "to do our best to satisfy customers". Our products have the best quality and reasonable prices. Our products sell well in South Asia, the Middle East, Europe, America, Australia, etc.

       We win recognition and support from more and more customers. We are looking forward to establishing long-term and cooperative relationships with customers to create glorious achievements. Please feel free to contact us for further information.

 

PCB Data Requirements

Board Data:

Board data can consist of the traditional data package which must include the following:

  • Gerber Data in the following formats:
    • 274D including separate aperture list with all apertures defined.
    • 274X - Preferred
    • Gerber files with aperture lists
    • DXF can be used requires an approval prior to production
    • ODB++ format
  • Drill Data in the following formats:
    • Excellon 1
    • Excellon 2

Also acceptable is ODB++ data. ODB++ will be supplied as a single file, usually with the extension of .tgz. ODB++ contains all the required board and drill information.

Note: Any other data formats need to be reviewed and approved by Golden Weald Engineering before the order can be placed. 

Fabrication instructions:

The fabrication instructions should contain all relevant information required to tool and build the part including:

  • Hole sizes with tolerances, and plating information
  • Board outline detail with all required dimensions and tolerances
  • Hole or feature to edge dimensions
  • Finished Copper Weights
  • Finished Board thickness with tolerances, and measurement criteria
  • Surface finish preference
  • Soldermask requirements
  • Silkscreen requirements
  • Technical contact information
  • Any additional requirements (i.e. impedance, controlled dielectrics, plugged vias, etc.)
     

The fabrication instructions may be found:

  • Fabrication Drawing:
    • Adobe Acrobat (.pdf)
    • Gerber
    • RS274X
    • HPGL
    • AutoCAD (.dwg or .dxf)
    • Graphic file (.jpg, .gif, .tif, etc.)
    • ODB++
    • Array configurations – tab or scored preference
  • Notes, read me files, and/or customer specification

Please keep reading the following specification about our PCB services:

Item
Specification
Remarks
Number of Layer
1-14 layers
 
Material
CEM-3,FR-4
High Tg CCL Is Available
Finish Board Thickness
0.2mm-3.20mm
 
( 8mil-126mil)
Minimun Core Thickness
0.075mm(3mil)
 
Copper Thickness
1/2 oz min; 3 oz max
 
Min.Trace Width & Line Spacing
0.075mm/0.1mm(3mil/4mil)
 
Min.Hole Diameter for CNC Driling
0.25mm(12mil)
 
Min.Hole Diameter for Punching
0.9mm(35mil)
 
Biggest Pabek Sise
700mm×510mm
 
 
Dunebsuib
Tikerabce
Hole Positon
+/-0.075mm(3mil) CNC Driling
 
Conductor Width(W)
+/-0.05mm(2mil)or
 
+/-20% of original artwork
Hole Diameter(H)
PTH L:+/-0.075mm(3mil)
 
Non-PTH L:+/-0.05mm(2mil)
Outline Tolerance
+/-0.125mm(5mil) CNC Routing
 
+/-0.15mm(6mil) by Punching
Warp & Twist
0.7%
 
Insulation Resistance
<50ohm
 
Test Voltage
300V
 
V-Cutting
Panel Size
110×100mm(min)
Jump Score Is Available
660×600mm(max)
Multilayers
Layer-layer misregistration
4 layers:0.15mm(6mil)max
 
6 layers:0.25mm(10mil)max
Min.spacing between hole edge to circuity pqttern of an inner layer
0.25mm(10mil)
 
Min.spacing between board oulineto circuitry pattern of an inner layer
0.25mm(10mil)
 
Board thickness tolerance
4 layers:+/-0.13mm(5mil)
 
6 layers:+/-0.15mm(6mil)
Impedance Control
20-75 ohm+/-10%
 
Different Impendance
75-150 ohm+/-10%
 
Finish Board Surface
HASL,OSP,Au /agimmersion,Au Plating Etc

 

Printed Circuit Board Reliability Test

        Golden Weald manufactured circuit boards go through a series of extensive tests and inspections at each step of the manufacturing process to assure the products we ship meets or exceed your specifications. Below are some of our circuit board test methods.


PCB Lamination

Test Item Test Method/Equipment Criteria Capability
Glass Transition D.S.C FR- 4 Tetra>130°(D.S.C) >132°
  T.M.A FR- 4 NP170>175°(D.M.A) >176°
Temperature D.M.A FR- 406>165°(D.S.C) >168°
Peel Strength IPC-TM-650 Trace to Laminate>9 lb/in (Normal Tg Material) >10 lb
Trace to Laminate 6 lb/in (High Tg Material) >6 lb
Layer to Layer>4 lb/in >6 lb

PCB Copper Plating

Test Item Test Method/Equipment Criteria Capability
Elongation Test TPC-TM-650 >6% >10%
Tensile Strength TPC-TM-650 >25kg/mm >30kgf

PCB Solderability

Test Item Test Method/Equipment Criteria Capability
PTH 1. Solder Pot Floating: No Dewetting Pass
    245°,4sec
SMD / BGA Pad 2. Wetting Balance

PCB Hole Wall Quality

Test Item Test Method/Equipment Criteria Capability
Temperature 125°,15Min 1. Hole Wall Resistance <20% 1. <20
    change after 1000 cycles  
       
Cycling -55°,15Min 2. Hole Wall Quality 2. No Crack
Thermal 125°,5min 1. Hole Wall Resistance<10% 1. <10%
    change after 100 cycle  
Shock -55°,5min 2. Hole wall Quality 2. No Crack
Thermal Stress 288°,10sec, No Delamination Pass
Solder Float No Hole Wall Detect

PCB Electrical Test

Test Item Test Method/Equipment Criteria Capability
High Pot. Test 1000 Volts,1minute <1mA Leakage Pass

PCB Environment Test

Test Item Test Method/Equipment Criteria Capability
Water Absorption 120°,2hrs,after 24hrs Wright Increase <0.24% <0.2%
Test (for BGA) after 24hrs test

PCB Cleanliness Test

Test Item Test Method/Equipment Criteria Capability
Surface Pre Condition:23°, Insulation Resistance >10G Ω
  50% RH,3hr After Black Oxide>10G Ω >10G Ω
Insulation   After O/L Etch>10G Ω >4G Ω
  Test Condition:35°, After HASL>3G Ω  
Resistance 85% RH,24hr    
Solvent Omega Meter 600 1. <6.4ugNacl/in² 1. Avg:<4
  SMD 15min    
Extract   2. <2.4ugNacl/in² 2. Avg:<2.0
  Omega Meter 500 (for BGA substrate)  
Conductivity SMD 15min (for BGA)    
       
  After Black Oxide,    
  O/L Etch, Finish Board    
High Humidity 50°,95%/RH, Resistance>1G Ω Pass
7days,100V Bias
I.C.T I.C.T 1. CI‾ <3ug/in² 1. Avg:<2.8
2. Br‾ <3ug/in² 2. Avg:<2
3. SO4²- <10ug/in² 3. Avg:<8

 

RoHS Compliance

Our Commitment to Environmental Responsibility

        Golden Weald  is a leader in Printed Circuit Board solutions and is committed to taking an active role in working closely with our customers and suppliers to identify and rapidly eliminate hazardous substances from their products. As an ISO 9001:2000 registered company, Golden Weald  is fully supportive of electronics industry efforts throughout the world to phase out the use of lead and other undesirable elements.

Lead Free & RoHS Compliant Initiative

        Golden Weald  is a leader in providing an extensive array of lead free printed circuit board solutions. Golden Weald ’s lead free products are fully RoHS compliant.

RoHS Restricted Materials

Banned Substance RoHS LIMIT: MCV* PPM
Lead (Pb) 1000
Mercury (Hg) 1000
Cadmium (Cd) 100
Hexavalent Chromium (Cr+6) 1000
Polybrominated Biphenyl (PBB) 1000
Polybrominated Diphenyl Ether (PBDE) 1000

* MCV - Maximum concentration values allowed in homogeneous materials